EP21HT
Master Bond Inc. develops a new two component, room temperature curing epoxy adhesive called EP21HT.
- Easy to use
- 1:1 ratio by weight or volume
- 100% reactive with no solvents or volatiles
- Strongly bonds to both simmilar and dissimilar substrates
- Service operating temperature range of -60 F to 400 F
- Electrical insulation properties once cured
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Master Bond Inc.
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